FusionAP

$2.0M pre-seed

Announced: May 19, 2026
Sector: Semiconductors
Investors: 2

Summary

FusionAP raised USD 2 million in a pre-seed funding round to build its advanced semiconductor packaging platform. The round was co-led by Vertex Ventures Southeast Asia & India and Southern Capital Group. FusionAP is a semiconductor packaging company.

Investors

Vertex Ventures Southeast Asia & India, Southern Capital Group